We use cookies to enable all functionalities for best performance during your visit and to improve our services by giving us some insight into how the website is being used. Continued use of our website without having changed your browser settings confirms your acceptance of these cookies. For details please see our privacy policy.
×
You are here: Home / Products / Switch / L3 GS560B-24X2C / GS560B-24X2C

Products

loading

GS560B-24X2C

GS560B-24X2C is a Layer 3 switch product which owns high-performance of full 10G access, 40G, and 100G uplink core routing. It can not only meet the high-density and high-bandwidth network application requirements of the next-generation enterprise network, data center and metropolitan area network, but also meet the application requirements of telecom network operators or campus Ethernet aggregation layer or access layer. Also, this device can be used as a data center connection layer.
  • GS560B-24X2C

  • GENEW

Availability:

Product Details

The product has an elastic stacking function, which virtualizes multiple devices into one logical entity. It can not only meet the expansion of ports and switching capacity, but also realize the unified management, upgrade, and maintenance of multiple devices. In response to the requirements of large data traffic and non-blocking transmission in the data center, this switch can provide a strong cache capacity, and support an advanced cache scheduling mechanism to ensure the maximum effective use of the device cache capacity. It is designed to meet the high-density and high-bandwidth network application requirements of next-generation enterprise networks, data centers and metropolitan area networks. It can be applied to network operators or campus Ethernet aggregation layer or access layer, and also be used as data center access layer, small and medium-sized enterprise core layer, and provides rich server access solutions for data centers.

Highlights

Specifications

Attributes

GS560B-24X2C

Port

24*1000M Base-X SFP/10GE SFP+, 2*40G QSFP/2*100G QSFP28

1+1 modular redundant power supply, two modular Fans

Chip Solution

Centec CTC713 Series

Exchange capacity

880Gbps

Packet Forwarding Rate

654Mbps

MAC

16K

Memory and Storage

Memory: RAM 1G; Storage: Flash 8G

Power

AC: 100~240V 47/63Hz;

DC: 36V~75V;

Power Consumption

≤125W

Weight

3.5kg

Dimensions

(W * D * H)

440×320×43.6

Environment temperature

Working Temperature:-10℃~55℃

Storge temperature:-40℃~70℃


Genew Technologies Co., Ltd., established in 2005, is a global system provider of end-to-end communication solutions and telecom infrastructures, it is listed on the Shanghai Stock Exchange (Stock Code: 688418.SS).

QUICK NAVIGATION

PRODUCT CATEGORY

Leave a Message
GET IN TOUCH

Thank you for your time! We have received your request and we will contact you as soon as possible.Thanks again for your interest in our company.

CONTACT INFORMATION

  +86-755-86099888
  +86-755-26619963
  F5/6/11, Richinfo Innovation Center, South Hi-tech Park, Nanshan District, Shenzhen City, 518057 P. R. China.
Copyright © 2021 Genew Technologies Co. Ltd. All Rights Reserved.  粤ICP备12060512号