GDES Series from Genew are high performance, high density Ethernet switching platforms designed for AI clusters and large scale data center environments. The portfolio comprises two models: the GDES2500S (800G) and GDES2601S (1.6T).
Powered by Broadcom Tomahawk 5 and Tomahawk 6 switch chips respectively, they deliver high density OSFP high speed interfaces with rich port breakout capabilities and line rate L2/L3 forwarding, well suited for leaf spine and super spine fabric architectures. Equipped with industrial grade control subsystems, Root of Trust hardware, comprehensive IEEE 1588 PTP and Synchronous Ethernet timing functions, as well as hot swappable redundant power supplies and fans, the switches hold complete international EMC and safety certifications to meet high bandwidth interconnection deployment requirements for AI computing clusters and cloud data centers.
GDES Series AI Fabric Switches
GENEW
|
| |
Product Description
GDES Series from Genew are high performance, high density Ethernet switching platforms designed for AI clusters and large scale data center environments. The portfolio comprises two models: the GDES2500S (800G) and GDES2601S (1.6T).
Powered by Broadcom Tomahawk 5 and Tomahawk 6 switch chips respectively, they deliver high density OSFP high speed interfaces with rich port breakout capabilities and line rate L2/L3 forwarding, well suited for leaf spine and super spine fabric architectures. Equipped with industrial grade control subsystems, Root of Trust hardware, comprehensive IEEE 1588 PTP and Synchronous Ethernet timing functions, as well as hot swappable redundant power supplies and fans, the switches hold complete international EMC and safety certifications to meet high bandwidth interconnection deployment requirements for AI computing clusters and cloud data centers.
Highlights
Highlight | Description |
|---|---|
Massive Switching Capacity | 51.2Tbps for GDES2500S and up to 102.4Tbps for GDES2601S. Line-rate L2/L3 forwarding supports extreme traffic workloads from AI clusters. |
Flexible Port Breakout | High-density OSFP interfaces support multi-rate breakout, enabling flexible networking with 800G/400G/200G/100G rates on single hardware. |
Carrier-Grade Hardware Reliability | Hot-swappable redundant power supplies and fans. Integrated BMC and Root-of-Trust (RoT) support remote management and hardware security protection. |
Precise Timing & Open Ecosystem | Native IEEE 1588 PTP and Synchronous Ethernet support. GDES2500S supports ONIE open installation environment; GDES2601S runs dedicated network OS, meeting timing alignment requirements for AI computing. |
Technical Parameters
Item | GDES2500S | GDES2601S |
|---|---|---|
Switch Silicon | Broadcom Tomahawk5 (BCM78900) | Broadcom Tomahawk6 (BCM78914) |
Switching Capacity | 51.2 Tbps | 102.4 Tbps |
High-Speed Data Ports | 64 × 800G OSFP800 | 64 × 1.6T OSFP224 |
Port Breakout | 400G / 200G /100G per port | 800G / 400G / 200G /100G per port |
Management Ports | 2 ×25G SFP28 in-band; RJ-45 Console, OOB management, USB3.0 | 2 ×25G SFP28 in-band; RJ-45 Console, OOB management, USB3.0 |
Mechanical Dimension | 2U, 438.4 mm × 648.2 mm × 88 mm, front-facing data ports | 3U, 440 mm × 648.2 mm × 131.6 mm |
Cooling System | 3+1 redundant hot-swappable fan modules, front-to-back airflow | 8 hot-swappable fan trays, front-to-back forced airflow |
Power Supply | 1+1 redundant hot-swappable 3000W AC/DC input | 2+2 redundant hot-swappable 2700W AC PSU |
Power Consumption(w/o optics) | Typical:1066W; Max:1684W | / |
Main CPU | Intel Ice Lake-D D1713 NTE 4-Core | Intel Ice Lake-D D-1713NT 4-Core |
Memory / Storage | 16GB×2 ECC DDR4; 240G M.2 NVMe SSD | 16GB×2 ECC DDR4; 240GB M.2 NVMe SSD |
BMC / RoT | AST2600 / AST1060 | AST2620 / AST1060 |
Timing & Sync | IEEE1588 PTP, Synchronous Ethernet; 10MHz,1PPS, TOD interfaces | IEEE1588 PTP, Synchronous Ethernet; 10MHz,1PPS, TOD interfaces |
Operating Temperature | 0℃- 40℃ | 0℃- 40℃ |
Software Environment | ONIE (Open Network Install Environment) | Dedicated Network Operating System |
